2 * 3mm Qhov Titanium Expanded Mesh Nrog Ir -Ta Txheej Rau Semiconductor Plating

2 * 3mm Qhov Titanium Expanded Mesh nrog Ir-Ta Txheej rau Semiconductor Plating yog tsim los ntawm ASTM B265 Qib 1 coj mus muag ntshiab titanium ntawv. Tsis zoo li stamped mesh, nthuav kev tsim tsim ib tug nruam pob zeb diamond-zoo li tus qhib- ntawm no teev raws li 2mm × 3mm- tsis muaj cov khoom poob los yog welded kev sib tshuam, khaws cia lub titanium substrate lub innate corrosion kuj thiab structural kev ncaj ncees. Cov kauj ruam nthuav dav orients strands ntawm lub kaum sab xis tswj, ua kom muaj txiaj ntsig zoo hauv cheeb tsam thaum tswj kev sib faib tam sim no thoob plaws lub ntsej muag anode. Rau semiconductor plating daim ntaub ntawv, qhov geometry no ncaj qha txhais tau tias ruaj khov electrolyte ntws los ntawm electrode, txo cov npuas entrapment, thiab cov kab hluav taws xob zoo ib yam, txhua qhov tseem ceeb rau kev ua tiav sub-micron plating uniformity ntawm wafer{14}}theem substrates. Tom qab kev nthuav dav, cov mesh tau ua kom nruj alkaline degreasing thiab acid etching kom tshem tawm cov oxides ib txwm muaj, kom ntseeg tau tias cov khoom siv hlau nplaum rau cov khoom sib xyaw ua ke tom ntej -hlau oxide txheej.

Lub iridium-tantalum (Ir-Ta) oxide txheej yog siv los ntawm thermal decomposition ntawm precursor ntsev, yielding ib dimensionally ruaj khov anode (DSA) tshwj xeeb engineered rau oxygen evolution nyob rau hauv sulfuric acid-raws li electrolytes uas muaj ib tug kab chlorides {{3}trymistry los yog ib tug plurality ntawm che da dej . 2* 3mm Qhov Titanium Expanded Mesh nrog Ir-Ta Txheej rau Semiconductor Plating muab cov pa oxygen evolution overpotential tsawg li 1.385V piv rau mercurous sulfate siv electrode, ncaj qha txo cov cell voltage thiab lub zog noj hauv pulse periodic reverse (PPR) plating ua haujlwm. Lub Ir-Ta formulation ua pov thawj zoo tshaj rau anodic dissolution nyob rau hauv siab -tam sim no{11}}ntaus pulses muaj nyob rau hauv tooj liab damascene cov txheej txheem, qhov twg ruthenium{12}}raws li txheej yuav raug kev txom nyem ceev degradation.

Tsis tas li ntawd, tantalum oxide tivthaiv stabilizes cov txheej txheem txheej, ncua kev ua haujlwm lifespan tshaj 36 lub hlis raws li ib txwm semiconductor foup-rau-foup plating cycles. Txhua qhov mesh raug tshuaj xyuas nrog lub tshuab tsis pom kev pom thaum lub sijhawm ua kom tiav thiab ua tiav, ua pov thawj thickness kam rau ua nyob rau hauv ± 0.05mm thiab ntug burr-dawb profiles sib xws nrog automated plating cuab yeej tuav. Qhov tshwm sim yog kev sib kis-dawb anode uas tswj qhov ruaj khov ntawm qhov ntev, tshem tawm cov khoom me me, thiab ua kom rov ua tau dua, siab -purity plating kev ua tau zoo xav tau rau kev sib txuas ntawm metallization siab heev.

Superior corrosion kuj nyob rau hauv chloride -muaj sulfuric acid

tantalum oxide tivthaiv stabilizes txheej matrix tiv thaiv anodic nres nyob rau hauv electrolytes uas muaj kab chlorides, tus txheej txheem additive nyob rau hauv advanced tooj liab plating chemistry. Titanium substrate tseem nyob tag nrho passivated, tshem tawm txoj kev pheej hmoo ntawm tooj liab paug los ntawm yaj hauv paus hlau.

Txo cov npuas npuas thiab txhim kho kev thauj mus los

Cov qauv qhib mesh tso cai rau evolved oxygen npuas kom tshem tawm sai sai ntawm lub electrode nto, txo ciam teb txheej tiv thaiv thiab tswj kom zoo ib yam electrolyte txaus. Stamped mesh los yog cov phaj khoom hloov ua kom muaj roj ntau dua, ua rau muaj kev tiv thaiv hauv cheeb tsam thiab plating tsis yog- tsis sib xws.

Kev kis kab mob - ua haujlwm dawb

Ob lub titanium substrate thiab Ir-Ta txheej yog inert nyob rau hauv plating tej yam kev mob. Tsis muaj txhuas, antimony, los yog lwm hom soluble raug tso tawm rau hauv electrolyte, tshem tawm qhov xav tau rau lub sij hawm hloov lub hnab anode thiab txo qhov tsis xws luag hauv sub-10μm nta.

 

Thickness kam rau ua thiab burr -dawb npoo

 

Ncej - nthuav dav flattening thiab ua tiav yog tswj nrog lub tshuab tsis pom kev, tuav lub thickness rau ± 0.05mm ntawm nominal thiab xyuas kom meej tag nrho cov strand npoo yog deburred. Qhov no tshem tawm txhua yam kev puas tsuaj rau daim nyias nyias nyias lossis wafer tuav cov cuab yeej.

Extended kev pab cuam lub neej

Kev ntsuas lub neej nrawm (ALT) qis dua 2 A / cm² hauv 1.5 M H₂SO₄ tsis tu ncua tshaj 36 lub hlis ntawm kev ua haujlwm tas mus li, nrog cov txheej txheem degradation qhia los ntawm qhov hluav taws xob nce es tsis muaj kev puas tsuaj loj, ua rau lub sijhawm ua haujlwm tau zoo.

Customizable geometric parameters

 

Thaum tau teev tseg raws li 2mm × 3mm qhib, cov txheej txheem nthuav dav tso cai rau kev ywj pheej ntawm txoj kab dav dav, qhib lub kaum sab xis, thiab qhib qhov feem pua, ua kom zoo dua rau cov txheej txheem plating tshwj xeeb thiab cov dej ntws tawm yam tsis muaj nqi rov qab.

• Copper damascene rau logic nodes - Anode los ua ke hauv 300mm plating cov cuab yeej rau void-dawb hauv qab-up sau ntawm sub-10nm trenches; nthuav mesh ua kom muaj kev sib faib tam sim no raws li PPR waveforms.

• Los ntawm -silicon ntawm (TSV) filling - Full-cross-section anode nyob rau hauv ntsug chambers rau 10:1–20:1 nam piv vias; tuav ruaj ruaj oxygen evolution thaum lub sij hawm txuas ntxiv siab -tam sim no- voj voog ceev.

• Kev faib tawm txheej txheej (RDL) ntawm vaj huam sib luag- qib ntim - Kab rov tav paddle plating systems; 2 × 3mm qhib ua kom tsis tu ncua electrolyte recirculation rau<3% thickness variation across 600mm substrates.

• Hauv qab -bump metallization (UBM) rau flip-chip - Segmented tam sim no tswj hauv cov cuab yeej xaiv plating; txheej withstands ncua sij hawm rov qab tu lub voj voog yam tsis muaj kev ua haujlwm drift.

• Embedded trace substrate (ETS) siab -kev sib cuam tshuam - Vertical nruam platers (VCP); anode vaj huam sib luag spans tag nrho substrate dav, minimizing luag- tawm thiab tshem tawm cov khoom ruaj ruaj phaj.

• Kub / npib tsib xee pob rau tsheb thiab cov khoom siv fais fab - Siab-tam sim no- ua haujlwm ceev (3-8 ASD); low overpotential txo electrolyte cua sov, khaws cia ruaj ntseg da dej rau 20-100μm pob.

• Electrolytic copper foil post-kev kho mob - Nruam kab rau 6-18μm ntawv ci; nthuav mesh ua rau niaj hnub niaj hnub hla 1400mm lub vev xaib dav hauv chromium-raws li qib passivation.

• Plating cuab tam retrofits – hloov ncaj qha rau Lam tshawb fawb, Applied Materials, NEXX systems; Ir-Ta coating muab ncua sij hawm kev pab cuam dua qub ruthenium-raws li anodes.

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